项目 Item |
内容 Content |
工艺能力 Process Capability |
备注 Remarks |
1 |
层数 Layer Count |
1-24层 |
指PCB中的电气层数(敷铜层数),目前只接受1~20层通孔板(接受盲埋孔板) |
2 |
板材 |
FR4,高Tg,无卤,罗杰斯,铁氟龙,ISOLA |
KB-6160(TG135),KB-6165F(TG150),KB-6167F(TG170),KB HF-140 |
CEM-1 |
KB-5150(TG130) |
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3 |
油墨 |
广信 |
无卤阻焊油墨 阻焊油墨 |
太阳 |
文字喷涂油墨 |
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4 |
生产板尺寸(最大) Panel Size(Max) |
1000mm*500mm |
单双面: 单片和拼板1000*500mm(V-CUT导轨方向宽度不过超过500mm) 多层板:单片625*500mm,拼板625*480mm(VCUT方向不可超过480mm) |
5 |
生产板尺寸(最小) Panel Size(Min) |
1×3mm |
单板最小生产尺寸>1×3mm,≤20×20mm为超小板 拼板最小生产尺寸>60×60mm 开V槽拼板最小生产尺寸>76×76mm 备注:OSP≥50*80mm 沉锡≥80*120MM |
6 |
板厚度(最大) Board Thickness(Max) |
10.0mm |
板厚:0.2/0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.2/6/10mm |
7 |
板厚度(最小) Board Thickness(Min) |
0.2mm |
|
8 |
芯板厚度(最小) Thin Core Thickness(Min) |
0.20mm |
含铜厚度 |
9 |
成品厚度公差(板厚≥0.8mm) Finished Board Thickness Tolerance(Board Thickness≥0.8mm) |
±10% |
比如板厚T=1.6mm,实物板厚为 |
10 |
成品厚度公差(0.4mm≤板厚< 0.8mm) Finished Board Thickness Tolerance(0.4mm≤Board Thickness<0.8mm) |
±0.10mm |
比如板厚T=0.6mm,实物板厚为 |
11 |
板曲(最小) Warpage(Min) |
≤0.75% |
对角线长度*0.75% |
12 |
钻孔孔径(最大) Drill Size(Max) |
Φ6.5mm |
大于6.5mm可扩孔 |
13 |
钻孔孔径(最小) Drill Size(Min) |
Φ0.15mm |
0.20mm是钻孔的最小孔径 |
14 |
外层底铜厚度(最小) Base Copper Thickness of Outer Layer(Min) |
0.5OZ |
指成品电路板外层线路铜箔的最小厚度,最小做到:单面板及双面Hoz、多层1/2oz |
15 |
外层底铜厚度(最大) Base Copper Thickness of Outer Layer(Max) |
12OZ |
指成品电路板外层线路铜箔的最大厚度,最大做到12oz |
16 |
内层底铜厚度(最小) Base Copper Thickness of inner Layer(Min) |
1/4OZ |
指成品电路板内层线路铜箔的最小厚度,最小做到1/4oz |
17 |
内层底铜厚度(最大) Base Copper Thickness of inner Layer(Min) |
4OZ |
指成品电路板内层线路铜箔的最大厚度,最大做到3oz |
18 |
绝缘层厚度(最小) Dielectric Thickness(Min) |
0.10mm |
PP胶片压合后厚度0.10mm |
19 |
孔电镀纵横比(最大) Aspect Ratio(Max) |
10:1 |
|
20 |
孔径公差(镀通孔) Hole Diameter Tolerance(PTH) |
±0.075mm |
镀铜孔:钻孔的公差为±0.075mm,例如设计为0.6mm的孔,实物板的成品孔径在0.525mm-0.675mm是合格允许的 |
21 |
孔径公差(非镀通孔) Hole Diameter Tolerance(NPTH) |
±0.05mm |
非镀铜孔:钻孔的公差为±0.05mm,例如设计为0.6mm的孔,实物板的成品孔径在0.55mm-0.65mm是合格允许的 |
22 |
孔位公差 Hole Position Tolerance(Compared with CAD Data) |
±0.05mm |
|
23 |
孔壁铜厚(通孔) Holewall Copper Thickness(Full Hole) |
常规平均值≥18um |
客户可另作指定 |
24 |
外层设计线宽/间距(最小) Line Width/Spacing of Outer Layer(Min) |
T/T OZ: 2.5mil/ 2.5mil(T=1/3oz) H/Hoz: 2.5mil/2.5mil 1/1oz: 3mil/3mil 2/2oz: 6mil/6mil 3/3oz: 10mil/10mil 4/4oz:14 mil/14 mil |
此 参 数 默 认 |
25 |
内层设计线宽/间距(最小) Line Width/Spacing of Inner Layer(Min) |
T/T oz: 2.5mil/ 2.5mil(T=1/3oz) H/H oz: 2.5mil/2.5mil 1/1 oz: 3mil/3mil 2/2 oz: 5mil/5mil 3/3 oz: 8mil/8mil |
此 参 数 默 认
|
26 |
蚀刻公差 Etching Tolerance |
±15% |
例如线宽 T=4mil,实际线宽为 |
27 |
外层图形对孔位精度(最小) Outer Image to Hole Tolerance(Min) |
±3mil |
线路图像对孔位精度,实物相差±3mil为合格 |
28 |
孔位对孔位精度(最小) Hole to Hole Tolerance(Min) |
±2mil |
线路图像孔位对实物孔位精度±2mil为合格 |
29 |
阻焊对位精度公差 Solder Mask Registration Tolerance |
±3mil |
线路图像对防焊位置精度公差±3mil为合格 |
30 |
阻焊厚度(最小) Solder Mask Thickness(Min) |
≥8μm |
阻焊采用广信油墨≥8μm |
31 |
阻焊桥宽(最小) Solder Mask Bridge Width(Min) |
绿油:4mil 黑/白色:5mil 其他杂色油:4mil |
若有阻焊桥要求,必须备注!若阻焊颜色为绿色焊盘间保留油墨宽度必须≥4mil(完成铜厚为1oz的线路焊盘间距需要有7mil),黑色、白色焊盘间保留油墨宽度必须≥5mil(完成铜厚为1oz的线路焊盘间距需要有7mil),其它杂色油焊盘间保留油墨宽度必须为≥4mil |
32 |
阻焊塞孔孔径 Solder Mask Plugged Hole Diameter |
≤0.45mm |
阻焊塞孔孔径规定≤0.45mm,板内孔≥0.45mm时默认塞油会不饱满 |
33 |
沉镍沉金镍厚 Minimum Nickel Thickness of ENIG |
100-200uin(μ") |
特殊需求可指定 |
34 |
沉镍沉金金厚 Minimum Gold Thickness of ENIG(Max) |
1-3uin(μ") |
特殊需求可指定 |
35 |
锡厚(热风整平) Solder Thickness on XFP (HAL) |
2-40μm |
|
36 |
铣外形公差 Routing Dimension Tolerance |
±4mil |
|
37 |
铣外形公差(孔到边) Routing Dimension Tolerance(Hole to Edge) |
±4mil |
|
38 |
铣外形圆弧(内角)(最小) Radius by Routing (Internal Angle)(Min) |
R≥0.5mm |
|
39 |
铣沉头孔孔径 Countersink Hole Size |
依客户要求 |
依客户要求 |
40 |
V-CUT剩余厚度公差(最小) V-CUT Remaining Thickness Tolerance(MIN) |
±0.10mm |
V-CUT剩余厚度公差最小±0.10mm |
41 |
V-CUT错位度(最小) V-CUT MISREGISTRATION (MIN) |
0.10mm |
V-CUT错位度最小0.10mm |
42 |
V-CUT板厚厚度(最小/最大) V-CUT Board Thickness(Min/Max) |
0.4mm/3.2mm |
目前支持V-CUT板厚0.5mm~3.2mm(≤0.4mm建议邮票孔,如指定V-CUT默认不满足±0.10mm公差) |
43 |
阻抗公差(最小) Impedance Tolerance(Min) |
±10% |
例如选择的阻抗值为T=50Ω,实际阻抗为 |
44 |
孔距/孔到线制程范围 |
|
VIA导通孔到孔0.3mm PTH元件孔到元件孔0.5mm VIA导通孔到线0.2mm PTH元件孔到线0.3mm |
45 |
高端选项工艺 |
V-CUT长度不受限制,四线飞测,双色阻焊,双色文字 |
V-CUT最近两刀距离≥2mm 飞测最小焊盘≥4*8mil(高端加收费时此条生效) 双色阻焊无缝对接公差+/-1mm |